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E-book Cold Micro Metal Forming
A typical example of the benefits and challenges of miniaturization is the ABS(anti-blocking system) in modern cars. Whilst the weight could be decreased toapprox. 10% of the weight of thefirst system, the part complexity has significantlyincreased. This is indicated by the decrease in the number of parts by approx. 90%in current systems, compared to thefirst versions [Nos14], even though additionalfunctions are integrated. The trend towards an increase in miniaturization can alsobe illustrated using the example of HF (high frequency) connectors, where nowa-days the minimum pin diameters commercially available off the shelf are in therange of 0.7 mm, with allowable tolerances for functional features of several?m.As in most of the applications discussed above, significant quantities of partsranging from several thousands to literally billions (e.g. for resistor end caps) haveto be produced, micro cold forming is among the dominant production processes.Examples of components (containing) micro parts produced by cold forming are(listed by their application areas):Medical technology/chemical technology: Hearing aid devices, cardiac pacemakers,micro pumps and micro pump couplings, microfluidic reactor devices;Automotive technology: ABS and other advanced assistance systems based onMEMS, contacts and connectors, fuel pumps, injection nozzles;Electronics: Battery caps, displays, diodes, electrodes, connectors, resistors, noz-zles, contactors;General industry: sensors (e.g. for pressure), hydraulic and pneumatic connectors,micro pumps, micro valves;Consumer electronics: smartphone speakers, electric blades, compact cameras,microphones.As afirst conclusion, wefind three main trends: an increase in miniaturization,an increase in functional integration, and an increase in total batch sizes. Moreover,common to many of these applications is the need for zero-defect quality. This isoften due not only to cost considerations, but also to the safety criticality of many ofthe components (ABS, medical devices).Consequently, and as most micro forming parts are produced under extreme costpressure, the complete process chain has to be optimized to enable furthercost-efficient miniaturization. This means that not only aspects relating to the microcold forming process as such (e.g. non-systematic scatter in material properties), butalso preceding and succeeding process steps (e.g. heat treatment) as well asmaterials handling have to be considered and optimized along the process chain.
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